1. 2. 3. material content data sheet sales product name ipp90n06s4-04 issued 29. august 2013 ma# MA000467716 package pg-to220-3-1 weight* 2036.44 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.184 0.25 0.25 2546 2546 leadframe non noble metal iron 7439-89-6 0.816 0.04 401 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 40.05 40.10 400372 400894 wire non noble metal aluminium 7429-90-5 6.411 0.31 0.31 3148 3148 encapsulation organic material carbon black 1333-86-4 8.888 0.44 4364 plastics epoxy resin - 97.767 4.80 48009 inorganic material silicondioxide 60676-86-0 485.875 23.86 29.10 238591 290964 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10539 10539 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder noble metal silver 7440-22-4 0.099 0.00 49 non noble metal tin 7440-31-5 0.079 0.00 39 non noble metal lead 7439-92-1 3.796 0.19 0.19 1864 1952 heatspreader non noble metal iron 7439-89-6 0.590 0.03 290 inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal copper 7440-50-8 589.466 28.95 28.99 289460 289837 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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